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. Decreases in bonded area, average shear strength, and pull strength are all indicators that when the bond is made, the area of contact between the bond wire and the pad will be sub-optimal
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image of a COB void (red). Sample & Method Many smart cards and hand-held toys use the COB design, where the die is attached and wire bonded directly to the board, then overmolded
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. Similar non-uniformity would be more serious in a device exposed to thermal cycling. The second bond pad from the left, however, appears to have no wire bonded to it
